Silicon Wafers In Plastic Holder Box

In this project we delivered a full turnkey upgrade of an ageing specialist glass grinding lathe used in semiconductor-related manufacturing.

The existing machine was built around outdated control hardware, limiting precision, reliability, repeatability and long-term maintainability. Rather than replacing the entire machine, the project focused on retaining the valuable mechanical platform while rebuilding the control architecture around modern CNC capability.

The work included assessment of the existing machine, control-system replacement, CNC implementation, electrical integration, motion-control set

up, commissioning, operator workflow improvements and process refinement.

A key requirement was to minimise disruption to the client’s manufacturing operation. The upgrade was planned and implemented with very limited downtime, allowing the client to gain a major operational improvement without the cost, delay or risk of sourcing an entirely new specialist machine.

The result was a modernised, more repeatable and more controllable production platform, extending the useful life of the equipment while significantly improving day-to-day capability.